ProMOS Technologies is renowned in the global DRAM industry for its outstanding performance in technology advancement and manufacturing efficiency. ProMOS started technology alliance with Hynix Semiconductor, the world's leading semiconductor memory company, in 2005 and had successfully transferred both 90 nm and 70 nm process technologies. After cooperating very successfully for two generations of technology transfer, ProMOS and Hynix signed a new Strategic Alliance Agreement for 50nm-class stack process technology node to further strengthen the relationship in 2008.

ProMOS Technologies operates one 200mm wafer fab (Fab1) and three advanced 300mm wafer fabs (Fab2, Fab3 and Fab4). Fab1 and Fab2, together with the headquarters, are located in Hsinchu Science Park, while Fab3 and Fab4 are located in Central Taiwan Science Park.

ProMOS is the very first DRAM company in Taiwan employing 90 nanometer process technology to produce high-density DRAM products in 2005, and later repeated the same feat in 2007 with 70nm technology.

ProMOS Technologies provides complete high-performance and high-density commodity DRAM memory chips as well as pseudo-SRAM, low power SDRAM products. The company sells and markets its own-branded products "ProMOS" to worldwide first-tier system houses. ProMOS Technologies has been awarded by its customers for "The Best DRAM Quality Supplier" for years.