Engineering Service
The comprehensive memory experience from ProMOS is essential to guarantee the capability in memory design, manufacturing, assembly engineering, field application and quality assurance. Therefore ProMOS could provide customer the relevant service and total solution.
Service Items:
Customized Product Service -MCP, SIP, RDL assembly engineering -Specialty product, over-speed, wide-temperature, wide-bandwidth DRAM Engineering Developing Service -Product characterization, failure analysis -Wafer testing development -Burn-in, final testing development Quality Engineering Service -Reliability / Quality test -System self-qualification -Cycling test (-40 ~ 125C) Field Application Engineering Service -IC re-ball, de-cap., mounting -System signal integrity -Application debugging